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Home > Jobing Community Blogs > Blog Post: Surface Mount Technology...
Blog Post: Surface Mount Technology Association Meeting June 3rd! Speaker Topic: Halogen Free PCB Material
posted Wednesday, May 28, 2008 3:59 PM
Halogen Free PCB Material
Please join us for a 30 minute presentation & Q&A from Stephen L.Tisdale, Packaging Manager from Intel CorporationGary Long, PCB Technology Development Engineer Topic: Halogen Free PCB Material Date: Tuesday, June 3rd 2008 Time: 11:30 am Cost: Members: $12, Non-Members $15 Location: Manpower 645 E Missouri, Ste 182 Phoenix, Az 85012 A catered Italian lunch will be provided to enjoy during the presentation. Stephen Tisdale has been with Intel for 4 years and is a Packaging Manager in the Customer Strategic Technology Integration Group within the Assembly, Test & Technology Development Division. He received a Bachelors in Chemistry from Holy Cross College, an MBA in Operations from U-Mass and a Masters in Program Management from George Washington University. Since joining Intel, he has worked on a number of lead-free and halogen-free projects, and chairs the Lead-Halogen-free Steering Committee, which directs the integration of lead-free and halogen free technology in Intel products. He is also involved in various Consortia Projects and addressing technical communications regarding pending legislation (RoHS II etc). Prior to joining Intel, Mr. Tisdale held various engineering and R&D management positions within the electronics industry. Gary Long has been with Intel Corporation for 8 years in the role of Printed Circuit Board Technology Development Engineer. His group is responsible for the development and integration of new technologies in next generation printed circuit board products. He is currently evaluating the impact of the halogen-free laminate transition for Intel printed circuit boards. Gary has published over a dozen papers regarding his PCB development work at Intel, and holds 12 patents related to printed circuit boards. Prior to Intel, he spent 20 years in various engineering and analytical roles in the printed circuit board fabrication industry. Gary is active in a number of industry consortia and specification committees, and chairs the IPC D-36 subcommittee responsible for the IPC PCQR2 Database. Speakers will cover the following: • Regulatory Landscape / NGO Activity • Definition of Halogen Free • Industry Activity • HDPUG • iNEMI • EPA • IPC / JEDEC • PCB Material / Challenges • Supplier Readiness • Path Forward Please RSVP by COB May 30th to Jessica Starr at: Tags
electronics,
soldering,
electronic assembly,
lead free,
halogen,
medical microelectronics,
pcb materials,
surface mount technology
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